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TNY263-268
DIP- 8 B
-E-
. 240  (6.10)
.260 (6.60)
Pin 1
⊕ D S .004 (.10)
.137 (3.4 8 )
MINIMUM
Notes:
1. Package dimensions conform to JEDEC specification
MS-001-AB (Issue B 7/ 8 5) for standard dual-in-line (DIP)
package with .300 inch row spacing.
2. Controlling dimensions are inches. Millimeter sizes are
shown in parentheses.
3. Dimensions shown do not include mold flash or other
protrusions. Mold flash or protrusions shall not exceed
.006 (.15) on any side.
4. Pin locations start with Pin 1, and continue counter-clock-
wise to Pin 8 when viewed from the top. The notch and/or
dimple are aids in locating Pin 1. Pin 6 is omitted.
5. Minimum metal to metal spacing at the package body for
the omitted lead location is .137 inch (3.4 8 mm).
-D-
.367 (9.32)
.3 8 7 (9. 8 3)
.057 (1.45)
.06 8 (1.73)
6. Lead width measured at package body.
7. Lead spacing measured with the leads constrained to be
perpendicular to plane T.
(NOTE 6)
.125 (3.1 8 )
.145 (3.6 8 )
-T-
.015 (.3 8 )
MINIMUM
SEATING
PLANE
.120 (3.05)
.00 8 (.20)
.015 (.3 8 )
.140 (3.56)
.300 (7.62) BSC
.100 (2.54) BSC
.04 8 (1.22)
(NOTE 7)
.014 (.36)
.022 (.56)
.053 (1.35)
⊕ T E D S .010 (.25) M
.300 (7.62 )
.390 (9.91)
P0 8 B
PI-2551-121504
19
www.powerint.com
Rev. H 02/09
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